Japan-Based Rapidus Receives ¥590 Billion Grant for Commercialization of Revolutionary 2nm Semiconductor Technology

Government Aid of $3.9 Billion Approved for Rapidus in Support of 2nm, Multi-Chiplet Technologies

In 2027, Japan-based Rapidus aims to commercialize 2nm process technology, which has been in development for years. To support its ambitious goals, the company received a significant grant of ¥590 billion yen ($3.89 billion) from the Japanese government. This funding will be used for various purposes, including developing the 2nm production node and purchasing cleanroom equipment.

With the added government support, Rapidus is well-positioned to achieve its ambitious goals. The total amount of funding provided by the government now amounts to ¥920 billion ($6.068 billion), giving the company a strong foundation on which to establish itself as a key player in the semiconductor industry. While the entire project is estimated to cost around ¥5 trillion ($32.983 billion), Rapidus is optimistic about securing the necessary financing with the help of major corporations like Toyota Motor and Nippon Telegraph and Telephone.

Rapidus expects to begin testing its production by April 2025, followed by large-scale production in 2027. Commercial production of 2nm chips is expected to begin in that same year. The company is collaborating with IBM to develop the 2nm fabrication process and constructing its manufacturing facility, while also focusing on advanced packaging technology for multi-chiplet system-in-packages (SiPs). A notable aspect of this project is that Rapidus will utilize a section of Seiko Epson Corporation’s Chitose Plant for its back-end packaging processes. This plant, located near Rapidus’ fab in Bibi World, an industrial park in Chitose City where pilot-stage research and development activities will take place, was chosen due to its convenience and suitability for collaborations and financial support.

In summary, Rapidus has received significant funding from both private corporations and government sources to develop cutting-edge semiconductor technology at a scale never before seen in Japan’s industry history. With their focus on advanced packaging technology and collaboration with leading players like IBM and Seiko Epson Corporation, Rapidus has set themselves up for success in revolutionizing semiconductor manufacturing with their innovative approach towards developing complex systems that can be mass produced at affordable prices.

The Japanese government’s commitment towards supporting this project speaks volumes about their belief in Rapidus’ potential as a game changer in the global semiconductor market. As commercialization approaches quickly over the next few years, we can expect some exciting developments from this ambitious project that could lead to new breakthroughs

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